| __timestamp | Autodesk, Inc. | Taiwan Semiconductor Manufacturing Company Limited |
|---|---|---|
| Wednesday, January 1, 2014 | 1090900000 | 24020800000 |
| Thursday, January 1, 2015 | 1281300000 | 22921900000 |
| Friday, January 1, 2016 | 1308900000 | 25696400000 |
| Sunday, January 1, 2017 | 1310300000 | 27169200000 |
| Monday, January 1, 2018 | 1392500000 | 26253700000 |
| Tuesday, January 1, 2019 | 1524000000 | 28085800000 |
| Wednesday, January 1, 2020 | 1715900000 | 35570400000 |
| Friday, January 1, 2021 | 1854200000 | 44488200000 |
| Saturday, January 1, 2022 | 2194800000 | 63445300000 |
| Sunday, January 1, 2023 | 2277000000 | 71464000000 |
| Monday, January 1, 2024 | 2443000000 | 96889000000 |
Unlocking the unknown
In the ever-evolving landscape of global technology, operational efficiency is paramount. This analysis delves into the Selling, General, and Administrative (SG&A) expenses of two industry giants: Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Autodesk, Inc., from 2014 to 2024.
TSMC, a leader in semiconductor manufacturing, has seen its SG&A expenses skyrocket by over 300% from 2014 to 2024, reflecting its aggressive expansion and market dominance. In contrast, Autodesk, a pioneer in 3D design software, experienced a more modest increase of approximately 124% over the same period.
While TSMC's substantial rise in expenses underscores its global scaling efforts, Autodesk's steady growth highlights its focus on innovation and customer-centric solutions. This comparison offers a window into the strategic priorities and operational challenges faced by these tech titans.
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