| __timestamp | Corpay, Inc. | Taiwan Semiconductor Manufacturing Company Limited |
|---|---|---|
| Wednesday, January 1, 2014 | 269591000 | 385113000000 |
| Thursday, January 1, 2015 | 439330000 | 433117600000 |
| Friday, January 1, 2016 | 621965000 | 473077100000 |
| Sunday, January 1, 2017 | 756337000 | 482616200000 |
| Monday, January 1, 2018 | 692584000 | 533487500000 |
| Tuesday, January 1, 2019 | 726044000 | 577283500000 |
| Wednesday, January 1, 2020 | 596363000 | 628124700000 |
| Friday, January 1, 2021 | 559819000 | 767877700000 |
| Saturday, January 1, 2022 | 764707000 | 915536500000 |
| Sunday, January 1, 2023 | 819908000 | 986625000000 |
| Monday, January 1, 2024 | 0 | 1269954000000 |
Igniting the spark of knowledge
In the ever-evolving landscape of global technology and financial services, Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Corpay, Inc. stand as titans in their respective fields. Over the past decade, TSMC has consistently demonstrated its dominance, with its cost of revenue soaring by approximately 230% from 2014 to 2023. This growth underscores TSMC's pivotal role in the semiconductor industry, driven by increasing demand for advanced chips.
Conversely, Corpay, Inc., a key player in financial services, has experienced a more modest yet steady increase of around 200% in its cost of revenue over the same period. This reflects its strategic expansion and adaptation in a competitive market. Notably, the data for 2024 is incomplete, highlighting the dynamic nature of these industries. As we look to the future, these trends offer valuable insights into the financial health and strategic priorities of these industry leaders.
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