| __timestamp | Corpay, Inc. | Taiwan Semiconductor Manufacturing Company Limited |
|---|---|---|
| Wednesday, January 1, 2014 | 281490000 | 24020800000 |
| Thursday, January 1, 2015 | 406790000 | 22921900000 |
| Friday, January 1, 2016 | 450953000 | 25696400000 |
| Sunday, January 1, 2017 | 603268000 | 27169200000 |
| Monday, January 1, 2018 | 631142000 | 26253700000 |
| Tuesday, January 1, 2019 | 683511000 | 28085800000 |
| Wednesday, January 1, 2020 | 567410000 | 35570400000 |
| Friday, January 1, 2021 | 747948000 | 44488200000 |
| Saturday, January 1, 2022 | 893217000 | 63445300000 |
| Sunday, January 1, 2023 | 943581000 | 71464000000 |
| Monday, January 1, 2024 | 997780000 | 96889000000 |
Unleashing the power of data
In the competitive world of global business, managing Selling, General, and Administrative (SG&A) expenses is crucial for profitability. From 2014 to 2023, Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Corpay, Inc. have shown contrasting approaches. TSMC, a titan in the semiconductor industry, has seen its SG&A expenses grow by approximately 197%, reflecting its expansive growth strategy. In contrast, Corpay, a financial services firm, has managed a more modest increase of around 235% over the same period, indicating a tighter control over its operational costs.
While TSMC's expenses surged, particularly in 2022 and 2023, Corpay's expenses remained relatively stable, with a peak in 2023. This data suggests that while TSMC invests heavily in its operations, Corpay maintains a leaner approach. Missing data for 2024 indicates potential shifts in strategy or reporting. Understanding these trends is vital for investors and analysts alike.
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