Selling, General, and Administrative Costs: Taiwan Semiconductor Manufacturing Company Limited vs Teledyne Technologies Incorporated

SG&A Costs: TSMC vs. Teledyne - A Decade of Growth

__timestampTaiwan Semiconductor Manufacturing Company LimitedTeledyne Technologies Incorporated
Wednesday, January 1, 201424020800000612400000
Thursday, January 1, 201522921900000588600000
Friday, January 1, 201625696400000574100000
Sunday, January 1, 201727169200000656000000
Monday, January 1, 201826253700000694200000
Tuesday, January 1, 201928085800000751600000
Wednesday, January 1, 202035570400000700800000
Friday, January 1, 2021444882000001067800000
Saturday, January 1, 2022634453000001156600000
Sunday, January 1, 2023714640000001208300000
Monday, January 1, 202496889000000
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Infusing magic into the data realm

A Tale of Two Giants: SG&A Costs in the Semiconductor and Technology Sectors

In the ever-evolving landscape of global technology, Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Teledyne Technologies Incorporated stand as titans in their respective fields. Over the past decade, TSMC has seen a staggering increase in its Selling, General, and Administrative (SG&A) expenses, growing by over 300% from 2014 to 2023. This reflects the company's aggressive expansion and investment in innovation. In contrast, Teledyne's SG&A costs have grown more modestly, increasing by approximately 97% over the same period, indicating a steady yet cautious approach to growth.

The data reveals a fascinating divergence in strategy: TSMC's rapid escalation in expenses suggests a focus on scaling operations and capturing market share, while Teledyne's more measured increase points to a strategy of sustainable growth. As we look to the future, these trends offer valuable insights into the strategic priorities of these industry leaders.

Missing Data: A Note

It's important to note that the data for 2024 is incomplete for Teledyne, which may affect future trend analysis.

Published by
U.S. Securities and Exchange Commission

Source link
sec.gov

Date published
28 Jan 2025