__timestamp | Fiserv, Inc. | Taiwan Semiconductor Manufacturing Company Limited |
---|---|---|
Wednesday, January 1, 2014 | 975000000 | 24020800000 |
Thursday, January 1, 2015 | 1034000000 | 22921900000 |
Friday, January 1, 2016 | 1101000000 | 25696400000 |
Sunday, January 1, 2017 | 1150000000 | 27169200000 |
Monday, January 1, 2018 | 1228000000 | 26253700000 |
Tuesday, January 1, 2019 | 3284000000 | 28085800000 |
Wednesday, January 1, 2020 | 5652000000 | 35570400000 |
Friday, January 1, 2021 | 5810000000 | 44488200000 |
Saturday, January 1, 2022 | 6059000000 | 63445300000 |
Sunday, January 1, 2023 | 6576000000 | 71464000000 |
Monday, January 1, 2024 | 6564000000 | 96889000000 |
Unleashing the power of data
In the ever-evolving landscape of global business, understanding the financial strategies of industry leaders is crucial. This analysis delves into the Selling, General, and Administrative (SG&A) expenses of two titans: Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Fiserv, Inc., from 2014 to 2023.
TSMC, a cornerstone of the semiconductor industry, has seen its SG&A expenses soar by approximately 198% over the decade, reflecting its aggressive expansion and innovation strategies. In contrast, Fiserv, a leader in financial services technology, experienced a more modest increase of around 575%, indicating a steady growth trajectory.
The data reveals a fascinating divergence in financial management approaches, with TSMC's expenses peaking in 2023, while Fiserv's growth appears more linear. This trend underscores the dynamic nature of global markets and the varied strategies companies employ to maintain their competitive edge.
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